The test program that runs on memory wafers at sort: functional, timing, retention and leakage tests, failure collection for repair analysis and the repair itself.
Test Work product in the Memory product lifecycle (DRAM, NAND and HBM)
Wafer test decides which memory dies are good, repairs those that can be repaired and supplies the data for yield learning. For stacked memory it is also the first stage of known good die screening. Without a solid program, bad dies move on to costly packaging or stacking, repairable dies are scrapped and yield learning lacks the bit map data it needs.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.