The test program run on each die at wafer probe to sort known-good die for assembly.
Test Work product in the Chiplet and advanced packaging lifecycle
It is the main screen before assembly. Its coverage decides package yield, because a die that passes sort but is faulty will scrap the whole package and the good dies in it.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.