The prober, optical sources, detectors, fibre or lens probes, electrical probes, software and calibration that together measure photonic die on the wafer.
Test Work product in the Silicon photonics and optical interconnect lifecycle
Optical probing is harder than electrical probing because coupling must be aligned at every die. An unqualified setup makes first light measurements slow, lets coupling repeatability swamp device variation and produces data that cannot be trusted for known good die decisions.
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