The early concept for the system's enclosure, cooling and mechanical layout: size and form, where the boards sit, airflow or conduction paths, materials and the main environmental and mechanical conditions, approved with the architecture.
Architecture Work product in the System development lifecycle
Thermal and mechanical limits constrain the chips, the boards and the power the system can use. Agreeing the concept early prevents a board design that cannot be cooled or does not fit the enclosure.
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