Results of testing assembled memory stacks: connectivity through the stack, function and speed of each die, repair after stacking and stack level yield.
Report Work product in the SoC and full-chip lifecycle, the Chiplet and advanced packaging lifecycle, the AI accelerator lifecycle and the Memory product lifecycle (DRAM, NAND and HBM)
Stack test shows whether known good die screening and the stacking process together deliver good stacks. The results guide improvements to die test and assembly and give customers evidence of stack quality for their qualification. Without them, the causes of stack loss stay unknown and expensive good dies continue to be scrapped with bad ones.
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