Packaged devices built from prototype wafer lots for characterisation, application testing and early customer evaluation, with build records and test results for each unit.
Physical item Work product in the Power and compound semiconductor lifecycle
Most device characterisation and all application testing need packaged parts. Uncontrolled sample packages give results nobody can trace to die or assembly conditions, customers evaluate inconsistent parts and package effects are confused with die effects.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.