The plan for reliability stresses that a technology, package or product must pass, defining mechanisms, test vehicles, stress conditions, sample sizes, durations and pass criteria.
Plan Work product in the Process technology (node) lifecycle, the Silicon photonics and optical interconnect lifecycle and the Package technology development lifecycle
It defines what reliability evidence qualification will produce, so all teams agree before costly stresses start. Tests added late, samples too few to conclude anything and a disputed qualification are what it prevents. It applies to process, photonic and package technologies with different mechanisms.
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