The design of the probe card for wafer test: probe technology and layout matched to the die's pads or bumps, the circuit board, power delivery, on-card components and the number of dies tested at once.
Design data Work product in the Test program and ATE development lifecycle
It sets whether wafer test can contact every die reliably and accurately at the planned parallelism. Without a sound design, contact problems, pad damage and long lead time redesigns delay wafer test and raise its cost.
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