Results of the package level qualification tests for the memory product, such as moisture sensitivity, temperature cycling, board level reliability and stack integrity.
Report Work product in the Memory product lifecycle (DRAM, NAND and HBM)
A memory die that passes its own tests can still fail through package cracking, warpage, bump fatigue or moisture damage. Package qualification proves the assembled product survives handling, board assembly and use. Without these results, component qualification is incomplete and the assembly control plan has no basis for its controls.
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