Electrical models of the package technology's interconnect, such as bumps, vias, redistribution and interposer lines, power delivery networks and die-to-die channels, released for customer design.
Model Work product in the Package technology development lifecycle
They let customers predict signal and power integrity of their designs before building them. Without released, correlated models, customers over-design with large margins or under-design and find signal or supply problems on first samples.
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