The report of qualification testing of the power module, such as power cycling, thermal cycling, humidity bias, high temperature blocking and vibration, with failure analysis and the qualification conclusion.
Report Work product in the Power and compound semiconductor lifecycle
It is the evidence that the module survives its intended use, and it underpins the datasheet, part approval and export classification. The module cannot be released for automotive or industrial use without it, and wear-out of die attach or wire bonds would be discovered in the field.
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