Chip lifecycle / Work products / Module and package concept

Module and package concept

The early concept for how the RF die is packaged or built into a module: package type, substrate, interconnect, integrated passives, shielding and antenna placement.

Architecture Work product in the RF and mmWave product lifecycle

Why it exists and what it decides

It fixes the main packaging choices early, because at RF and millimetre-wave frequencies the package is part of the circuit. A die designed before the concept is agreed at architecture freeze may rest on interconnect and loss assumptions the final package cannot meet.

Decisions it informs

Which package or module type the product uses
Whether the antenna is integrated in the package
Which interconnect and substrate technology is assumed in design

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