Early electrical, thermal and mechanical modelling of candidate package concepts, showing whether each can meet the technology targets before test vehicles are designed.
Analysis Work product in the Package technology development lifecycle
It screens concepts by physics before money is spent on hardware. A concept that cannot meet thermal or warpage limits at the target size would otherwise be found only on the first test vehicles.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.