A report comparing electrical, thermal, warpage and stress model predictions with measurements on package technology test vehicles, showing how accurate the models are and what was corrected.
Report Work product in the Package technology development lifecycle
It establishes how far the models can be trusted before they are released to customers in the design kit. Customers designing with uncorrelated models get optimistic or wrong answers, and the design rules derived from them do not protect yield or reliability.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.