Measured and supplier properties of the candidate package materials, such as modulus, expansion, glass transition, moisture uptake, adhesion and dielectric properties, across temperature.
Record or register Work product in the Package technology development lifecycle
It is the input to warpage, stress and electrical models and to material selection. Models run on datasheet values that do not match the materials as processed find warpage or delamination only on the first builds.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.