The test flow that screens memory dies at wafer level so that only fully functional, repaired and reliable dies are stacked into high bandwidth memory.
Test Work product in the Memory product lifecycle (DRAM, NAND and HBM)
In a stack, one bad die can scrap all the good dies stacked with it, so stack yield depends on testing each die thoroughly before assembly. The flow defines that screening. Without it, stack yield collapses and cost per good stack becomes uneconomic.
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