Wafer sort results that identify which dies are good enough for multi-die assembly, with grades and traceability.
Report Work product in the Chiplet and advanced packaging lifecycle
In a multi-die package one bad die ruins the whole assembly and the other good dies with it. Sort results let only known-good die go forward and allow dies to be matched by grade, which protects package yield and cost.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.