The released design files for fabricating the interposer, bridge and package substrate, with drawings, stack-ups and electrical test data.
Design data Work product in the Chiplet and advanced packaging lifecycle
It is what interposer and substrate suppliers build from. Errors or inconsistencies between files cause delays, supplier queries or unusable parts, and a stack-up that differs from the one analysed can ruin signal integrity.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.