Chip lifecycle / Work products / Interface ASIC wafers

Interface ASIC wafers

The first processed wafers of the interface ASIC, received from the wafer supplier with their lot data, ready for probe and assembly with MEMS dies.

Physical item Work product in the MEMS and sensors lifecycle

Why it exists and what it decides

They are the physical ASIC dies that combine with MEMS dies to make the first prototypes. Untracked lot data and allocation mix splits, assemble dies before they are probed and leave later results untraceable to the wafer that produced them.

Decisions it informs

How wafers are split between probe, prototype assembly and analysis
Whether the wafers meet supplier acceptance data
Which wafers carry process splits for evaluation

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