The complete ordered sequence of process steps, from starting material to finished wafer or package, with the target conditions for each step and the links between modules.
Specification Work product in the Process technology (node) lifecycle, the Memory product lifecycle (DRAM, NAND and HBM) and the Package technology development lifecycle
It is the master recipe of the technology, joining separately developed modules into a working whole. Module teams otherwise develop steps that do not fit together, interactions are missed and the baseline cannot be frozen. In package technology and memory lifecycles the same discipline applies to assembly and array flows.
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