The results of final test on assembled packages, by unit and lot, with yield, failures and analysis.
Report Work product in the Chiplet and advanced packaging lifecycle
It shows whether assembled packages work and why some fail. It feeds interoperability testing, qualification, failure analysis and the decision to ship samples, and it shows whether losses come from dies, links or assembly.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.