The specification of how fibres connect to the photonic chip and leave the package: fibre type, array pitch and order, coupler positions, polarisation handling, connector and strain relief.
Specification Work product in the Silicon photonics and optical interconnect lifecycle
It ties the chip layout, the package and the external optical connection together in one agreed definition. Couplers placed where the fibre array cannot reach, channel order reversed between chip and connector and a module connector that does not match the customer's system follow when it is missing.
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