Reports on why parts failed, in qualification, production or the field, with the root cause and corrective action.
Analysis Work product in the SoC and full-chip lifecycle, the Chiplet and advanced packaging lifecycle, the Silicon photonics and optical interconnect lifecycle, the Power and compound semiconductor lifecycle, the MEMS and sensors lifecycle and the Package technology development lifecycle
They find out why parts failed and what must change to stop it happening again, protecting customers and yield. Shallow analysis leads to corrective actions that treat symptoms, failures that recur and the same mechanism reaching other products.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.