Chip lifecycle / Work products / Die-to-die interface specification

Die-to-die interface specification

The specification of the links between dies: protocol, physical layer, lanes, bump use, timing, power and test.

Specification Work product in the Chiplet and advanced packaging lifecycle

Why it exists and what it decides

All dies and the package must build to the same interface. If there is no single agreed specification, dies from different teams or suppliers cannot talk to each other, or the package channel cannot meet the rate, and the mismatch is found only at assembly.

Decisions it informs

Whether to use a public interface standard or a custom link
Which lane count and data rate the link targets
Which test, training and repair features are required

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