A study of how light will get on and off the photonic chip, comparing fibre, lens and edge or surface coupling options for loss, tolerance and manufacturability.
Analysis Work product in the Silicon photonics and optical interconnect lifecycle
Coupling loss and alignment tolerance often dominate the link budget and the assembly cost. An architecture that assumes a coupling loss assembly cannot achieve makes packaging the reason the product misses cost or margin. The study supports the TR1 platform and coupling feasibility review.
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