A roadmap of planned actions to reduce the cost of the package technology over time, such as yield improvement, material changes, larger panels or wafers, and throughput gains.
Plan Work product in the Package technology development lifecycle
It keeps the technology competitive as prices fall over its life. Opportunistic cost work leaves changes unqualified in time, and customers move to cheaper alternatives.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.