The model of product cost across dies, interposer or bridge, substrate, assembly, test and yield, used to judge the multi-die approach and its sourcing.
Analysis Work product in the Chiplet and advanced packaging lifecycle
Chiplet designs trade die cost and die yield against package cost, assembly yield and complexity. A cost model shows whether the trade pays off at the planned volumes and where cost really lies; without it, a multi-die design can cost more than the single die it replaced.
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