The plan of changes to reduce the unit cost of a power or compound product, such as larger wafers, cheaper or second-source substrates, die shrinks, process simplification or package changes, with their qualification needs.
Plan Work product in the Power and compound semiconductor lifecycle
Wide bandgap products must keep reducing cost to win against silicon and competitors. Cost-down changes made piecemeal underestimate qualification and customer notification, and changes reach customers without proper approval.
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