A report on defects found in interposer, through-silicon via and hybrid bonding steps during pilot production, with defect types, causes, fixes and the yield learning achieved.
Report Work product in the Package technology development lifecycle
It drives bonding yield up during the yield readiness phase by turning defect data into fixes. Bonding defects often kill whole stacks, so without systematic learning the technology stays too costly to sell and the same defect sources recur.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.