A report of first-pass and final yield through each assembly step for photonic packages, with loss categories and their causes.
Report Work product in the Silicon photonics and optical interconnect lifecycle
It shows where assembled units are lost and whether the known good die criteria and package design are good enough for an economic product. Assembly losses absorbed silently keep the cost model optimistic and leave the team unsure whether to tighten die screening or change the package.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.