The ordered sequence of assembly steps that turns MEMS and ASIC dies into a packaged sensor, with materials, equipment, parameters and controls for each step.
Specification Work product in the MEMS and sensors lifecycle
It fixes how the sensor is built so that the stress, cavity and contamination conditions assumed in design are reproduced in every part. MEMS output is sensitive to assembly, so without a defined flow offset, drift and stiction vary from lot to lot and qualification results do not apply to production.
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