The control plan for package assembly: each assembly step, the characteristics controlled, the methods, limits, sampling and reaction plans.
Plan Work product in the Memory product lifecycle (DRAM, NAND and HBM) and the Power and compound semiconductor lifecycle
Qualification proves the package can be built well under controlled conditions; the control plan makes sure every production lot is built the same way. It turns qualification findings into routine controls on the line. Without it, assembly drifts, defects such as voids, cracked dies or warpage reach customers and stacked memory or power modules fail in the field.
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