1. Purpose and scope
Space parts are screened one by one. Screening removes parts with latent defects before they fly: burn-in under bias at temperature, temperature cycling, mechanical tests, hermeticity checks for sealed packages, inspection, and electrical tests at temperature before and after stress with limits on parameter drift. The flow comes from the quality level and qualification framework, extended for any sensitivity the part has shown.
Lot acceptance tests are run on samples from each wafer or assembly lot to show the lot is as good as the qualified one. For hardened parts, radiation lot acceptance tests samples from each wafer lot to the hardness level. The stage defines both flows, proves them on real lots and gets them approved.
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