1. Purpose and scope
In many photonic products the package costs more than the dies and carries most of the yield and reliability risk. Fibres must be aligned to the chip, often to a small fraction of the mode size, and held there through assembly, temperature cycling and years of operation. The laser must be attached with its own alignment where it is not on the wafer. In co-packaged optics the optical engine shares a substrate with a switch or processor, so its assembly is tied to the host package.
This stage designs and develops that assembly, shows that it is capable, and builds the engineering samples and the qualification units. It ends when the assembly process is qualified and engineering samples go to lead customers.
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