1. Purpose and scope
Qualification of the technology happens before any customer product is qualified on it. Test vehicles built on the frozen baseline are stressed at component level, typically moisture preconditioning to the classification the technology claims, temperature cycling, humidity with or without bias, high temperature storage and, for stacked and fine-pitch structures, tests aimed at the new interfaces. Board-level tests mount the package on test boards and cycle it in temperature, and where the market needs it, drop and bend it. Electromigration tests stress bumps, pillars and redistribution lines with current at temperature.
Every failure is analysed. The value of the stage is not only that tests pass but that the technology's weak points are known, with root causes, so the design kit can state its limits and lead customers can plan their own qualification with confidence. Failure analysis uses electrical isolation, X-ray, acoustic microscopy, cross-sections and microscopy, and each result goes back to integration and module owners.
In scope: the final reliability test plan, qualification lots, component and board-level tests, electromigration and other wear-out studies, failure analysis, material qualification results and the technology qualification report. Out of scope: customer product qualification, which is done in Lead Customer Joint Development & Qualification on the customer's own design.
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