1. Purpose and scope
Customers design their packages, interposers and substrates to the provider's rules. The package design kit plays the role for package design that a process design kit plays for chip design: it is the contract between the technology and its users. It holds the assembly design rules, the substrate and interposer rules, the stack-ups and material data, electrical, thermal and mechanical models with their validity ranges, bump and pad libraries, rule checking decks for the design tools customers use, and reference designs that show the rules in use.
The purpose of this stage is to turn the qualified technology into a kit that customers can design with safely. Every final rule is traced to qualified hardware or to a stated limit; models are correlated across the qualified range; decks are checked on reference designs and test cases; and the kit is released in versions, each with release notes and known limits. The kit must also agree with the process design kits of the wafer processes whose pads, bumps and top metal it lands on.
In scope: rules, stack-ups, models, libraries, decks, reference designs, kit quality assurance, release notes and customer support for kit questions. Out of scope: customers' own designs, which are reviewed in the joint development stage.
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