1. Purpose and scope
Prototypes are where models meet reality. The first MEMS wafers show whether films, etches, release and seals behave as the baseline promised; the first ASIC wafers show whether the readout performs as simulated; and the first assemblies show how the two behave together in a package. Measuring them needs physical stimulus, such as controlled rotation and acceleration, pressure, sound, light or gas, at controlled temperature, as well as electrical tests.
The main job of the stage is model correlation. Sensitivity, resonance frequencies, quality factor, offset, noise and temperature behaviour are compared with the multiphysics and system models, and model parameters such as material properties, gaps and stress are fitted until the models reproduce the measurements. Only correlated models can be trusted to set the package stress isolation, the calibration model and test limits later. The stage also decides whether a redesign is needed: none, a MEMS change, an ASIC change or both.
In scope: prototype MEMS wafers, interface ASIC wafers, prototype assemblies, wafer probe results, prototype measurement data, the model to measurement correlation report, ASIC silicon evaluation, process window learning, the redesign decision, first drivers and the evaluation kit, the preliminary datasheet, engineering samples and the sample plan. Out of scope: freezing the package, which belongs to Packaging That Admits the Environment, and the production calibration method.
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