1. Purpose of the gate
This is the first decision point of the chiplet lifecycle and opens the System Partitioning & Package Architecture stage. It answers one question: is a multi-die approach the right way to meet this product's requirements, and is the business willing to fund the work needed to prove it? The review does not fix the partitioning or the packaging technology; it agrees that they are worth working out, and sets the boundaries within which the team will work.
A multi-die approach brings benefits such as smaller dies with better wafer yield, the freedom to put each function on the node that suits it, reuse of proven dies, and products that scale by adding dies. It also brings costs and risks: die-to-die links, advanced packaging, known-good-die testing, assembly yield, more suppliers and more interfaces to manage. The gate makes sure the case weighs both honestly against a single-die alternative.
On the product track this gate corresponds to the product's own concept approval, so the decision is usually taken in the same forum and recorded once.
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