1. Purpose and scope
Every die in a multi-die product meets its neighbours through die-to-die links. This stage defines those links completely: the protocol layer and how traffic is mapped onto it, the physical layer and its signalling, the number of lanes and modules per boundary, sideband and management channels, clocking, power states, and the test and lane repair features that let faults be found and worked around after assembly.
The stage also produces the bump map: the exact position, net and function of every bump on every die face that touches another die, the interposer, the bridge or the substrate. The bump map is the contract between die teams, the package team and the assembly supplier. Once it is frozen, each die and the package can be designed in parallel without waiting for each other.
Most programmes follow an open die-to-die standard so that dies from different sources can work together and be reused. The stage then becomes one of selecting the right options and profiles in that standard, confirming that the chosen packaging technology supports them, and documenting anything left to the implementer.
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