Delayed, as of 05:30 UTC. Source: delayed quotes from a public quote service, refreshed at most every two minutes. Prices in each listing's own currency. Market data, not investment advice.
San Jose, United States · Listed on the Hub · Posted by the company · Listed until
As a Principal Package Signal & Power Integrity Engineer at Astera Labs, you will serve as a senior technical leader responsible for architecting, optimizing, and signing off package SIPI solutions for next-generation connectivity products. You will drive package electrical architecture across high-performance IC packaging platforms, including FCBGA, coreless substrates, chiplet-based packages, 2.5D/3D integration, silicon interposers, bridge-based interconnect, and heterogeneous multi-die systems.
The full job description and the way to apply are for registered members. Registration is free and takes a minute. You come back to this page afterwards.