Term · Reliability & Quality
Wire bond lift
Separation of a wire bond from its pad or lead, caused by intermetallic growth, corrosion, contamination, mould compound shear during cycling, or insufficient bond energy at assembly.
It appears as an open or intermittent connection.
- Also known as
- Ball bond lift, bond lift-off
- Type
- Term
- Domain
- Reliability & Quality, Package reliability
Notes
The shift from gold to cheaper copper wire lowered intermetallic risk but demands tighter bond force and inert cover gas control.
Related terms
Part of the Reliability & Quality glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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