Process · Packaging & Assembly
Via-last
A through-silicon via scheme in which vias are formed after the full wafer has been processed, often from the back side of an already thinned wafer. It avoids disturbing the front end flow but generally yields larger vias.
- Also known as
- Via last TSV, Backside via
- Type
- Process
- Domain
- Packaging & Assembly, Through-silicon via
Notes
Favoured by image sensor and MEMS makers who want to add vertical connections without changing a qualified front end process.
Related terms
Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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Used on 2 pages of the Hub. In each group, the pages that mention it most come first.
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