Process · Photonics, MEMS & Sensors
Photonic packaging
The assembly discipline that gives a photonic chip its optical, electrical and thermal interfaces, covering fibre alignment, laser attach, wirebond or flip-chip electrical connection and sealing.
- Also known as
- PIC packaging
- Type
- Process
- Domain
- Photonics, MEMS & Sensors, Photonic packaging
Notes
Often cited as 60 to 80 percent of the cost of a photonic module, and the main barrier to volume scaling.
Related terms
Part of the Photonics, MEMS & Sensors glossary, with every term in the topic and the lifecycles, tools and standards that use them.
Where it appears on the Hub
Used on 2 pages of the Hub. In each group, the pages that mention it most come first.
Skills
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Last reviewed: not yet reviewed in depth. Entry last updated . The full glossary