Glossary comparison
Flip chip vs Wire bonding: what is the difference?
The difference
Wire bonding keeps the die face up and connects pads around its edges with fine wires. Flip chip turns the die face down and connects it through bumps that can cover its whole surface, with much shorter paths.
Flip chip mounts the die face down and connects it through bumps spread across its surface. Wire bonding keeps the die face up and connects pads near its edges with wires.
The two terms
Flip chip
Mounting a die face down so its I/O bumps connect directly to the substrate or another die, instead of routing signals out through wires from the die edge. It shortens interconnect, raises I/O density and improves power delivery.
Wire bonding
Connecting die bond pads to package leads or substrate fingers with fine gold, copper or aluminium wire, formed loop by loop using heat, ultrasonic energy and force.
Side by side
| Field | Flip chip | Wire bonding |
|---|---|---|
| Stands for | Not an abbreviation | Not an abbreviation |
| Type | Technology | Process |
| Domain | Packaging & Assembly | Packaging & Assembly |
| Group | Die attach and interconnect | Die attach and interconnect |