Term · Packaging & Assembly
Ballout
The assignment of signals, power and ground to the physical ball or land positions on the bottom of a package, together with the map that documents it. It determines board escape difficulty, layer count and power integrity.
- Also known as
- Ball map, Pin map
- Type
- Term
- Domain
- Packaging & Assembly, Package design and modelling
Notes
Changing a ballout late is costly because it invalidates substrate design, board layout and sometimes the die pad ring.
Related terms
Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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