Acronym · Power & Discretes
AMB (Active Metal Brazing)
A substrate process that joins copper to ceramic using a braze alloy containing an active element such as titanium, rather than direct oxide bonding. It is the standard route for silicon nitride substrates used in high-reliability SiC modules.
- Also known as
- AMB substrate, Si3N4 AMB
- Type
- Acronym
- Domain
- Power & Discretes, Power packaging
Notes
Si3N4 AMB survives far more thermal cycles than alumina DBC, which is why automotive SiC modules specify it.
Related terms
Part of the Power & Discretes glossary, with every term in the topic and the lifecycles, tools and standards that use them.
Where it appears on the Hub
Used on 1 page of the Hub. In each group, the pages that mention it most come first.
Suggest an improvement
Suggest an improvement to this entry
A clearer definition, an example, a correction or a source an editor can check. Editors review every suggestion before the entry changes.
Last reviewed: not yet reviewed in depth. Entry last updated . The full glossary