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Events / Global directory / International Symposium on 3D Power Electronics Integration and Manufacturing
International Symposium on 3D Power Electronics Integration and Manufacturing
(3D-PEIM)
Tier 3: niche / regionalSymposium / WorkshopCompound & Power Semi
Usual timing
Normally held in June. No confirmed next-edition date yet.
Organizer
IEEE PELS and IMAPS
Cadence
Biennial
Usual host
Rotating, Rotating
Venue
—
Format
In-person
Scale
<500
Audience
Power module packaging and 3D integration researchers
Notes
Symposium on three-dimensional integration and manufacturing methods for power electronics modules.
From The Semiconductor Hub's Global Semiconductor Events Directory: a research seed, not yet editorially verified row by row. Spotted an error?Let us know.