Events / Global directory / JIEP Annual Meeting

JIEP Annual Meeting

(JIEP Spring Meeting)

Tier 3: niche / regionalAcademic / ResearchAdvanced Packaging

Usual timing

Normally held in March. No confirmed next-edition date yet.

Organizer: Japan Institute of Electronics Packaging (JIEP)
Cadence: Annual
Usual host: Tokyo, Tokyo, Japan
Venue: —
Format: In-person
Scale: <500
Audience: Electronics packaging researchers and materials suppliers in Japan
Website: www.jiep.or.jp/en/

Notes

Spring conference of Japan's electronics packaging institute, the domestic counterpart to ECTC for 3D and heterogeneous integration research.

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