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Normally held in November. No confirmed next-edition date yet.
Organizer
IEEE Electronics Packaging Society Japan Chapter
Cadence
Annual
Usual host
Kyoto, Kyoto, Japan
Venue
—
Format
In-person
Scale
<500
Audience
Japanese packaging researchers
Notes
Japanese IEEE EPS symposium on packaging, interconnect and system integration.
From The Semiconductor Hub's Global Semiconductor Events Directory: a research seed, not yet editorially verified row by row. Spotted an error?Let us know.