Deca Technologies, based in Tempe in the United States, develops fan-out wafer-level packaging and licenses it to manufacturers. Its M-Series packaging and Adaptive Patterning technology are used for chips in smartphones and other devices.
Deca Technologies is listed in the OSAT / Packaging segment of the semiconductor value chain and is headquartered in Tempe, United States. It is privately held.
Website: thinkdeca.com (opens in a new tab)
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